발행물
컨퍼런스
IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
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Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission
8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC)
Signal Integrity Design of High-speed Semiconductor Test Probe Card
Signal Integrity of High Bandwidth Memory (HBM) Interposer
Design of Magnetic Shielding for Reduction of Magnetic Near Field from Wireless Battery Charging System for Electric Vehicle
Eye Diagram Estimation on Silicone Rubber Socket