발행물
컨퍼런스
8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC)
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A Fast Channel Simulation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer
2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO)
TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC
Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Modeling and Measurement of High-bandwidth and High-density Silicone Rubber Socket for 100Gbps Transceiver IC Test
Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module