발행물

전체 논문

217

31

High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test
Junyong Park, Hyesoo Kim, Jonghoon J. Kim, Dong-Hyun Kim, Kyungjune Son, Subin Kim, Seongsoo Lee, Kyungjun Cho, Bumhee Bae, Dongho Ha, Michael Bae, Joungho Kim
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, 2018.05

32

Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System
Shinyoung Park, Jinwook Song, Subin Kim, Youngwoo Kim, Manho Lee, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018.04

33

Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC
Jaemin Lim, Jonghyun Cho, Daniel H Jung, Jonghoon J. Kim, Sumin Choi, Dong-Hyun Kim, Manho Lee, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2018.02

34

EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field
Chiuk Song, Hongseok Kim, Youngwoo Kim, Donghyun Kim, Seungtaek Jeong, Yeonje Cho, Seongsoo Lee, Seungyoung Ahn, Joungho Kim
IEEE Transactions on Industrial Electronics, 2018.01

35

Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High Bandwidth Memory (HBM) Interface
Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Heegon Kim, Sumin Choi, Subin Kim, Junyong Park, Seongsoo Lee, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018.01

36

Pin-Opt: Graph Representation Learning for Large-Scale Pin Assignment Optimization of Microbumps Considering Signal and Power Integrity
Kim, Joungho, Park, Joonsang, Choi, Seonguk, Son, Keeyoung, Lee, Junghyun, Shin, Taein, Kim, Keunwoo, Sim, Boogyo, Kim, Seongguk, Kim, Jihun, Yoon, Jiwon, Kim, Youngwoo
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202404

37

Policy-Based Reinforcement Learning for Through Silicon Via Array Design in High-Bandwidth Memory Considering Signal Integrity
Kim, Joungho, Son, Kyungjune, Lho, Daehwan, Sim, Boogyo, Kim, SeongGuk, Shin, Taein, Kim, Keunwoo, Son, Keeyoung, Park, Joonsang, Park, Hyunwook, Kim, Youngwoo, Park, Shinyoung
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 202402

38

Bayesian Exploration Imitation Learning-Based Contextual via Design Optimization Method of PAM-4-Based High-Speed Serial Link
Park, H[Park, Hyunwook], Kim, J[Kim, Jihun], Kim, M[Kim, Minsu], Kim, H[Kim, Haeyeon], Choi, S[Choi, Seonguk], Park, J[Park, Joonsang], Sim, B[Sim, Boogyo], Son, K[Son, Keeyoung], Kim, S[Kim, Seongguk], Song, JW[Song, Jinwook], Kim, Y[Kim, Youngwoo], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 202312

39

Fast and Accurate Computation of Wireless Power Transfer System Optimal Design Using Particle Swarm Optimization Method
Kim, Keunwoo, Sim, B[Sim, Boogyo], Shin, T[Shin, Taein], Park, H[Park, Hyunwook], Son, K[Son, Keeyoung], Lho, D[Lho, Daehwan], Kim, S[Kim, Seongguk], Yoon, J[Yoon, Jiwon], Kim, H[Kim, Hyunwoo], Lee, J[Lee, Junghyun], Kim, J[Kim, Juneyoung], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 202312

40

Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module
Kim, Joungho, Sim, Boogyo, Kim, SeongGuk, Son, Keeyoung, Kim, Jihun, Park, Joonsang, Choi, Seonguk, Kim, Hae-Yeon, Park, Hyunwook, Kim, Minsu, Song, Jinwook, Kim, Youngwoo
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202311