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전체 논문

217

41

Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices
Jeong, S[Jeong, Seungtaek], Kim, TW[Kim, Tae-Wook], Lee, SS[Lee, Seongsoo], Sim, B[Sim, Boogyo], Park, H[Park, Hyunwook], Son, K[Son, Kyungjune], Son, K[Son, Keeyoung], Kim, S[Kim, Seongguk], Shin, T[Shin, Taein], Kim, YC[Kim, Young-Cheon], Kim, Joungho, Kim, BJ[Kim, Byoung-Joon]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202211

42

Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM)
Park, H[Park, Hyunwook], Kim, M[Kim, Minsu], Kim, S[Kim, Seongguk], Kim, Keunwoo, Kim, H[Kim, Haeyeon], Shin, T[Shin, Taein], Son, K[Son, Keeyoung], Sim, B[Sim, Boogyo], Kim, S[Kim, Subin], Jeong, S[Jeong, Seungtaek], Hwang, C[Hwang, Chulsoon], Kim, Joungho
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 202211

43

Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module
Son, K[Son, Keeyoung], Kim, S[Kim, Seongguk], Park, H[Park, Hyunwook], Shin, T[Shin, Taein], Kim, Keunwoo, Kim, M[Kim, Minsu], Sim, B[Sim, Boogyo], Kim, S[Kim, Subin], Park, G[Park, Gapyeol], Park, S[Park, Shinyoung], Jeong, S[Jeong, Seungtaek], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202209

44

A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection
Zhang, SY[Zhang, Shuye], Park, J[Park, Junyong], Park, G[Park, Gapyeol], Kim, Joungho, Paik, Kyung-Wook, He, P[He, Peng]
JOURNAL OF ADVANCED JOINING PROCESSES, 202206

45

Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer
Lho, D[Lho, Daehwan], Park, H[Park, Hyunwook], Park, S[Park, Shinyoung], Kim, S[Kim, Subin], Kang, HM[Kang, Hyungmin], Sim, B[Sim, Boogyo], Kim, S[Kim, Seongguk], Park, J[Park, Junyong], Cho, KJ[Cho, Kyungjun], Song, J[Song, Jinwook], Kim, Y[Kim, Youngwoo], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 202202

46

Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure
Son, K[Son, Kyungjune], Kim, Joungho, Son, K[Son, Keeyoung], Kim, M[Kim, Minsu], Park, H[Park, Hyunwook], Lho, D[Lho, Daehwan], Kim, Keunwoo, Lee, S[Lee, Seongsoo], Jeong, S[Jeong, Seungtaek], Park, S[Park, Shinyoung], Hong, S[Hong, Seokwoo], Park, G[Park, Gapyeol]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202201

47

Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme
Kim, S[Kim, Seongguk], Kim, S[Kim, Subin], Cho, K[Cho, Kyungjun], Shin, T[Shin, Taein], Park, H[Park, Hyunwook], Lho, D[Lho, Daehwan], Park, S[Park, Shinyoung], Son, K[Son, Kyungjune], Park, G[Park, Gapyeol], Jeong, S[Jeong, Seungtaek], Kim, Y[Kim, Youngwoo], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202111

48

Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer
Park, G[Park, Gapyeol], Kim, Y[Kim, Youngwoo], Cho, K[Cho, Kyungjun], Park, J[Park, Junyong], Hwang, I[Hwang, Insu], Kim, J[Kim, Jihye], Son, K[Son, Kyungjune], Park, H[Park, Hyunwook], Watanabe, AO[Watanabe, Atom O., Raj, PM[Raj, Pulugurtha Markon, Tummala, RR[Tummala, Rao R.], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 202110

49

Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network
Shin, T[Shin, Taein], Park, S[Park, Shinyoung], Kim, S[Kim, Seongguk], Kim, S[Kim, Subin], Son, K[Son, Kyungjune], Park, H[Park, Hyunwook], Lho, D[Lho, Daehwan], Cho, K[Cho, Kyungjun], Park, G[Park, Gapyeol], Gong, K[Gong, Kyubong], Jung, S[Jung, Seongtaek], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202107

50

A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System
Sim, B[Sim, Boogyo], Jeong, S[Jeong, Seungtaek], Kim, Y[Kim, Youngwoo], Park, S[Park, Shinyoung], Lee, S[Lee, Seongsoo], Hong, S[Hong, Seokwoo], Song, J[Song, Jinwook], Kim, H[Kim, Hongseok], Kang, H[Kang, Hyungmin], Park, H[Park, Hyunwook], Lho, D[Lho, Daehwan], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 202106