발행물

전체 논문

217

81

Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling
Kim, Joungho, Kim, Y[Kim, Youngwoo], Kim, JJ[Kim, Jonghoon J.], Cho, K[Cho, Kyungjun], Cho, J[Cho, Jonghyun], Kim, S[Kim, Subin], Sitaraman, S[Sitaraman, Srikri, Sundaram, V[Sundaram, Venky], Raj, PM[Raj, Pulugurtha Markon, Tummala, RR[Tummala, Rao R.]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201706

82

An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC
Kim, Joungho, Choi, SM[Choi, Sumin], Kim, HG[Kim, Hee-Gon], Lim, JM[Lim, Jaemin], Jung, DH[Jung, Daniel Hyunsuk], Kim, JJ[Kim, Jonghoon J.]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201706

83

Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC
Kim, DH[Kim, Dong-Hyun], Kim, Y[Kim, Youngwoo], Cho, JH[Cho, Jong-Hyun], Bae, B[Bae, Bumhee], Park, J[Park, Junyong], Lee, H[Lee, Hyunsuk], Lim, J[Lim, Jaemin], Kim, JJ[Kim, Jonghoon J.], Piersanti, S[Piersanti, Stefan, de Paulis, F[de Paulis, France, Orlandi, A[Orlandi, Antonio], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201706

84

Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems
Park, SJ[Park, Sung Joo], Bae, B[Bae, Bumhee], Kim, Joungho, Swaminathan, M[Swaminathan, Ma
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 201706

85

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis
Bae, HC [Bae, Hyun-Cheol], Jung, DH[Jung, Daniel Hyunsuk], Kim, Y[Kim, Youngwoo], Kim, JJ[Kim, Jonghoon J.], Kim, H [Kim, Heegon], Choi, S[Choi, Sumin], Song, YH [Song, Yoon-Ho], Choi, KS [Choi, Kwang-Seong], Piersanti, S [Piersanti, Stefa, de Paulis, F [de Paulis, Franc, Orlandi, A [Orlandi, Antonio], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201701

86

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel
Kim, Y[Kim, Youngwoo], Cho, J[Cho, Jonghyun], Kim, JJ[Kim, Jonghoon J.], Kim, K[Kim, Kiyeong], Cho, K[Cho, Kyungjun], Kim, S[Kim, Subin], Sitaraman, S[Sitaraman, Srikri, Sundaram, V[Sundaram, Venky], Raj, PM[Raj, Pulugurtha Markon, Tummala, R[Tummala, Rao], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201612

87

Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs
Song, J[Song, Jinwook], Park, S[Park, Shinyoung], Kim, S[Kim, Sukjin], Kim, JJ[Kim, Jonghoon J.], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201608

88

Low EMF and EMI Design of a Tightly Coupled Handheld Resonant Magnetic Field (HH-RMF) Charger for Automotive Battery Charging
Song, C[Song, Chiuk], Kim, H[Kim, Hongseok], Jung, DH[Jung, Daniel Hyunsuk], Kim, JJ[Kim, Jonghoon J.], Kong, S[Kong, Sunkyu], Kim, J[Kim, Jiseong], Ahn, S[Ahn, Seungyoung], Kim, J[Kim, Jonghoon], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201608

89

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs
Jung, DH[Jung, Daniel Hyunsuk], Kim, HG[Kim, Hee-Gon], Kim, Joungho, Cho, JH[Cho, Jong-Hyun]
IEEE DESIGN & TEST OF COMPUTERS, 201603

90

Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage
Kim, HS[Kim, Hongseok], Song, C[Song, Chiuk], Jung, DH[Jung, Daniel Hyunsuk], Kim, DH[Kim, DongHyun], Kim, J[Kim, Jong Hoon], Ahn, S[Ahn, Seungyoung], Kim, Joungho, Kim, IM[Kim, In Myoung], Kim, YI[Kim, Young Il]
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 201602