발행물

전체 논문

217

61

Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System
Lee, S[Lee, Seongsoo], Kim, D[Kim, Dong-Hyun], Cho, Y[Cho, Yeonje], Kim, H[Kim, Hongseok], Song, C[Song, Chiuk], Jeong, S[Jeong, Seungtaek], Song, J[Song, Jinwook], Park, G[Park, Gyeyoung], Hong, S[Hong, Seokwoo], Park, J [Park, Junyong ], Cho, K[Cho, Kyungjun], Lee, H[Lee, Hyunsuk], Seo, C[Seo, Chulhun], Ahn, S[Ahn, Seungyoung], Kim, Joungho
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 201906

62

Smartwatch Strap Wireless Power Transfer System with Flexible PCB Coil and Shielding Material
Jeong, S[Jeong, Seungtaek], Kim, D[Kim, Dong-Hyun], Song, J[Song, Jinwook], Kim, H[Kim, Hongseok], Lee, S[Lee, Seongsoo], Song, C[Song, Chiuk], Lee, J[Lee, Jaehak], Song, J[Song, Joonyub], Kim, Joungho
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 201905

63

Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC
Kim, S[Kim, Subin], Kim, Y[Kim, Youngwoo], Cho, K[Cho, Kyungjun], Song, J[Song, Jinwook], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201902

64

Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via
Cho, K[Cho, Kyungjun], Kim, Y[Kim, Youngwoo], Lee, H[Lee, Hyunsuk], Song, J[Song, Jinwook], Park, J[Park, Junyong], Lee, S[Lee, Seongsoo], Kim, S[Kim, Subin], Park, G[Park, Gapyeol], Son, K[Son, Kyungjune], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201901

65

High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test
Park, J[Park, Junyong], Kim, H[Kim, Hyesoo], Kim, J[Kim, Jonghoon J.], Kim, D[Kim, DongHyun], Son, K[Son, Kyungjune], Kim, S[Kim, Subin], Lee, S[Lee, Seongsoo], Cho, K[Cho, Kyungjun], Bae, B[Bae, Bumhee], Ha, D[Ha, Dongho], Bae, M[Bae, Michael], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201812

66

Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC
Kim, Joungho, Lim, J[Lim, Jaemin], Cho, J[Cho, Jonghyun], Jung, DH[Jung, Daniel Hyunsuk], Kim, JJ[Kim, Jonghoon J.], Choi, S[Choi, Sumin], Kim, DH[Kim, Dong-Hyun], Lee, MH[Lee, Man Ho]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201812

67

A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels
Kim, Joungho, Choi, S[Choi, Sumin], Kim, JJ[Kim, Jonghoon J.], Kim, Y[Kim, Youngwoo], Lee, MH[Lee, Man Ho], Kim, HG[Kim, Hee-Gon], Bae, B[Bae, Bumhee], Song, H[Song, Huijin], Cho, K[Cho, Kyungjun], Lee, S[Lee, Seongsoo], Lee, H[Lee, Hyunsuk], Park, J[Park, Junyong]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201810

68

Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface
Cho, K[Cho, Kyungjun], Kim, Y[Kim, Youngwoo], Lee, H[Lee, Hyunsuk], Kim, H.[Kim, Heegon], Choi, S[Choi, Sumin], Song, J[Song, Jinwook], Kim, S[Kim, Subin], Park, J[Park, Junyong], Lee, S.[Lee, Seongsoo], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201809

69

EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field
Kim, Joungho, Song, C[Song, Chiuk], Kim, Y[Kim, Youngwoo], Kim, DH[Kim, Dong-Hyun], Jeong, ST[Jeong, Seung Taek], Cho, Y[Cho, Yeonje], Lee, S[Lee, Seongsoo], Ahn, S[Ahn, Seungyoung], Kim, H[Kim, Hongseok]
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 201809

70

Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems
Kim, Joungho, Cho, Y[Cho, Yeonje], Lee, S[Lee, Seongsoo], Kim, DH[Kim, Dong-Hyun], Kim, H[Kim, Hongseok], Song, C[Song, Chiuk], Kong, S[Kong, Sunkyu], Park, J[Park, Junyong], Seo, C[Seo, Chulhun]
IEEE Transactions on Electromagnetic Compatibility, 201808