발행물

전체 논문

217

91

Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems
Kim, Joungho, Cho, YJ[Cho, Yeonje], Kim, JH[Kim, Jonghoon], Kim, DH[Kim, DongHyun], Lee, SS[Lee, Seongsoo], Kim, HS[Kim, Hongseok], Song, CU[Song, Chiuk], Kong, S[Kong, Sunkyu], Ahn, S[Ahn, Seungyoung], Kim, H [Kim, Hyoungjun], Seo, C [Seo, Chulhun]
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 201602

92

Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages
Kim, Joungho, Kumar, G[Kumar, Gokul], Sitaraman, S[Sitaraman, Srikri, Cho, J[Cho, Jonghyun], Sundaram, V[Sundaram, Venky], Tummala, RR [Tummala, Rao R]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201601

93

Recent advances in electromagnetic compatibility of 3D-ICS - Part II
Li, EP[Li, Er-Ping ], Sicard, E[Sicard, Etienne ], Jianfei, W[Jianfei, Wu ], Shen, R[Shen, Rongjun], Liu, EX[Liu, En-Xiao ], Kim, Joungho, Cho, JH[Cho, Jeong-Hyeon], Swaminathan, M[Swaminathan, Ma
IEEE Electromagnetic Compatibility Magazine, 2016

94

Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias
Piersanti, S[Piersanti, Stefan, de Paulis, F[De Paulis, France, Orlandi, A[Orlandi, Antonio], Kim, DH[Kim, Dong-Hyun], Kim, Joungho, Fan, J[Fan, Jun]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201512

95

High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling
Kim, S[Kim, Sukjin], Jung, DH[Jung, Daniel Hyunsuk], Kim, JJ[Kim, Jonghoon J.], Bae, B[Bae, Bumhee], Kong, S[Kong, Sunkyu], Ahn, S[Ahn, Seungyoung], Kim, J[Kim, Jonghoon], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201507

96

Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation
Kim, Joung-Ho, Bae, B[Bae, Bumhee], Kim, JH[Kim, Jonghoon], Kim, SJ[Kim, Suk Jin], Kong, SK[Kong, Sunkyu]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201506

97

An Investigation of Electromagnetic Radiated Emission and Interference From Multi-Coil Wireless Power Transfer Systems Using Resonant Magnetic Field Coupling
Kong, SK[Kong, Sunkyu], Bae, B[Bae, Bumhee], Jung, DH[Jung, Daniel Hyunsuk], Kim, JJ[Kim, Jonghoon J.], Kim, SJ[Kim, Suk Jin], Song, C[Song, Chiuk], Kim, J[Kim, Jonghoon], Kim, Joung-Ho
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 201503

98

MINI-SPECIAL ISSUE ON 2014 IEEE WIRELESS POWER TRANSFER CONFERENCE (WPTC 2014)
Kim, Joungho, Ahn, S[Ahn, Seungyoung]
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 201503

99

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission
Kim, HG[Kim, Hee-Gon], Cho, JH[Cho, Jong-Hyun], Kim, JH[Kim, Joo-Hee], Choi, S[Choi, Sumin], Kim, KY[Kim, Ki-Yeong], Lee, J[Lee, Junho], Park, K[Park, Kunwoo], Pak, JS[Pak, Jun So], Kim, Joung-Ho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201501

100

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)
Kim, DH[Kim, Dae Hyun], Athikulwongse, K[Athikulwongse, Healy, MB[Healy, Michael B.], Hossain, MM[Hossain, Mohammad, Khorosh, I[Khorosh, Ilya], Kumar, G[Kumar, Gokul], Lee, YJ[Lee, Young-Joon], Lewis, DL[Lewis, Dean L.], Lin, TW[Lin, Tzu-Wei], Liu, C[Liu, Chang], Panth, S[Panth, Shreepad], Pathak, M[Pathak, Mohit], Ren, MZ[Ren, Minzhen], Shen, GH[Shen, Guanhao], Song, TG[Song, Taigon], Woo, DH, Zhao, X[Zhao, Xin], Kim, Joung-Ho, Choi, H[Choi, Ho], Loh, GH[Loh, Gabriel H.], Lee, HHS[Lee, Hsien-Hsin S.], Lim, SK[Lim, Sung Kyu], Jung, M[Jung, Moongon]
IEEE TRANSACTIONS ON COMPUTERS, 201501