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전체 논문

217

101

Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure
Kim, JJ[Kim, Jonghoon J.], Cho, C[Cho, Changhyun], Bae, B[Bae, Bumhee], Kim, SJ[Kim, Suk Jin], Kong, SK[Kong, Sunkyu], Kim, HG[Kim, Hee-Gon], Jung, DH[Jung, Daniel Hyunsuk], Kim, JS[Kim, Ji-Seong], Kim, Joung-Ho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201412

102

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via
Jung, DH[Jung, Daniel Hyunsuk], Kim, HG[Kim, Hee-Gon], Kim, SJ[Kim, Suk Jin], Kim, JJ[Kim, Jonghoon J.], Bae, B[Bae, Bumhee], Kim, J[Kim, Jonghoon], Yook, JM[Yook, Jong-Min], Kim, JC[Kim, Jun-Chul], Kim, Joung-Ho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 201411

103

High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via
Yook, JM[Yook, Jong-Min], Pak, JS[Pak, Jun So], Cho, JH[Cho, Jong-Hyun], Lee, J[Lee, Junho], Kim, Joungho, Park, K[Park, Kunwoo], Kim, JH[Kim, Joo-Hee], Kim, JC[Kim, Jun Chul]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201404

104

Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System
Kim, JS[Kim, Ji Seong], Ahn, S[Ahn, Seungyoung], Park, S[Park, Seongwook], Kim, Joungho, Kim, JH[Kim, Jong Hoon], Kim, N[Kim, Nam], Chun, Y[Chun, Yangbae], Kim, H[Kim, Hongseok]
IEICE TRANSACTIONS ON COMMUNICATIONS, 201402

105

Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel
Shin, MC[Shin, Min-Chul], Kim, M[Kim, Myunghoi], Kim, JS[Kim, Ji-Seong], Kim, Joungho, Ahn, S[Ahn, Seungyoung]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201401

106

Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis
Bae, B[Bae, Bumhee], Shim, Y[Shim, Yujeong], Koo, K[Koo, Kyoungchoul], Cho, J[Cho, Jonghyun], Pak, JS[Pak, Jun So], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201312

107

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs
Kim, K[Kim, Kiyeong], Yook, JM[Yook, Jong Min], Kim, J[Kim, Junchul], Kim, H[Kim, Heegon], Lee, J[Lee, Junho], Park, K[Park, Kunwoo], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201311

108

Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs
Song, ES[Song, Eun-Seok], Koo, KC[Koo, Kyoung-Choul], Pak, JS[Pak, Jun-So], Kim, Joung-Ho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201309

109

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System
Kim, JS[Kim, Ji Seong], Kim, JH[Kim, Jong Hoon], Kong, S[Kong, Sunkyu], Kim, H[Kim, Hongseok], Suh, IS[Suh, In-Soo], Suh, NP[Suh, Nam Pyo], Cho, Dong-Ho, Kim, Joungho, Ahn, S[Ahn, Seungyoung]
PROCEEDINGS OF THE IEEE, 201306

110

Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs
Kim, MH[Kim, Myung-Hoi], Koo, KC[Koo, Kyoung-Choul], Shim, YJ[Shim, Yu-Jeong], Hwang, CS[Hwang, Chul-Soon], Pak, JS[Pak, Jun-So], Ahn, SY[Ahn, Seung-Young], Kim, Joung-Ho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201304