발행물

전체 논문

217

141

Co-modeling, experimental verification, and analysis of chip-package hierarchical power distribution network
Park, HJ[Park, Hyun-Jeong], Kim, HS[Kim, Hyung-Soo], Pak, JS[Pak, Jun-So], Yoon, CW[Yoon, Chang-Wook], Koo, KC[Koo, Kyoung-Choul], Kim, Joung-Ho
IEICE TRANSACTIONS ON ELECTRONICS, 200804

142

A delay line circuit design for crosstalk minimization using genetic algorithm
Chung, C, Lee, S, Kwak, BM[Kwak, Byung Man], Kim, G, Kim, Joungho
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 200803

143

Design of a low-noise UWB transceiver SiP
Yoon, CW, Park, YJ, Lee, JW, Park, HJ, Kim, JM, Pak, JS, Kim, Joungho
IEEE DESIGN & TEST OF COMPUTERS, 200801

144

Suppression of power/ground inductive impedance and simultaneous switching noise using silicon through-via in a 3-D stacked chip package
Ryu, C, Park, J, Pak, JS, Lee, K, Oh, T, Kim, Joungho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200712

145

Multiport measurement method using a two-port network analyzer with remaining ports unterminated
Kam, DG[Kam, Dong Gun], Kim, Joungho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200709

146

Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications
Choi, JW[Choi, Jinwoo ], Kam, DG[Kam, Dong Gun], Chung, DH[Chung, Daehyun], Srinivasan, K[Srinivasan, Kris, Govind, V[Govind, Vinu], Kim, Joungho, Swaminathan, M[Swaminathan, Ma
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200705

147

Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model
Pak, JS[Pak, Jun So], Kim, H[Kim, Hyungsoo], Lee, J[Lee, Junwoo], Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200702

148

A three-dimensional stacked-chip star-wiring interconnection for a digital noise-free and low-jitter I/O clock distribution network
Ryu, C, Chung, D, Lee, C, Kim, Joungho, Bae, K, Yu, J, Lee, S
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200612

149

Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor
Kim, Joungho, Jeong, Y
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200610

150

Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications
Park, J, Lu, ACW, Chua, KM, Wai, LL, Lee, J, Kim, Joungho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200609