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전체 논문

217

131

Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission
Song, EH[Song, Eak-Hwan], Cho, JH[Cho, Jeong-Hyeon], Kim, Joung-Ho, Shim, YJ[Shim, Yu-Jeong], Kim, GW[Kim, Ga-Won]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201005

132

A Compact and Wide-Band Passive Equalizer Design Using a Stub With Defected Ground Structure for High Speed Data Transmission
Shim, YJ[Shim, Yu-Jeong], Lee, WJ[Lee, Woo-Jin], Song, EH[Song, Eak-Hwan], Cho, JH[Cho, Jeong-Hyeon], Kim, Joung-Ho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 201005

133

Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC
Kim, Joungho, Li, E[Li, Erping]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201005

134

A 3-D Low Jitter and Skew Clock Distribution Network Scheme Using LTCC Package Level Interposer With a Planar Cavity Resonator
Lee, WJ[Lee, Woo-Jin], Kim, JM[Kim, Jae-Min], Ryu, CH[Ryu, Chung-Hyun], Park, JB[Park, Jong-Bae], Kim, JC[Kim, Jun-Chul], Kim, Joung-Ho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200908

135

Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package
Shim, YJ[Shim, Yu-Jeong], Park, JB[Park, Jong-Bae], Kim, JM[Kim, Jae-Min], Song, EH[Song, Eak-Hwan], Yoo, JS[Yoo, Jeong-Sik], Pak, JS[Pak, Jun-So], Kim, Joung-Ho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 200908

136

A Wide-Band Passive Equalizer Design on PCB Based on Near-End Crosstalk and Reflections for 12.5 Gbps Serial Data Transmission
Song, EH[Song, Eak-Hwan], Cho, JH[Cho, Jeong-Hyeon], Lee, WJ[Lee, Woo-Jin], Shin, MC[Shin, Min-Chul], Kim, Joung-Ho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200812

137

Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis
Kim, GW[Kim, Ga-Won], Kam, DG[Kam, Dong-Gun], Lee, SJ[Lee, Seung-Jae], Kim, JM[Kim, Jae-Min], Ha, MH[Ha, Myun-Hyun], Koo, KC[Koo, Kyoung-Choul], Pak, JS[Pak, Jun-So], Kim, Joung-Ho
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 200808

138

Modeling and measurement of interlevel electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model
Kim, JM[Kim, Jae-Min], Jeong, YC[Jeong, You-Chul], Lee, JH[Lee, Jun-Ho], Ryu, CH[Ryu, Chung-Hyun], Shim, JJ[Shim, Jong-Joo], Shin, MC[Shin, Min-Chul], Kim, Joung-Ho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200808

139

40-Gb/s package design using wire-bonded plastic ball grid array
Kam, DG[Kam, Dona Gun], Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200805

140

High dielectric constant tape double-stacked EBG structure for broadband suppression of SSN in LTCC-based SiP applications
Park, J, Lu, ACW, Sunappan, V, Wai, LL, Kim, Joungho
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 200804