발행물

전체 논문

217

111

Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC
Koo, KC[Koo, Kyoung-Choul], Kim, MH[Kim, Myung-Hoi], Kim, JJ[Kim, Jonghoon J.], Kim, Joung-Ho, Kim, JS[Kim, Ji-Seong]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201303

112

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects
Kim, KY[Kim, Ki-Yeong], Hwang, CS[Hwang, Chul-Soon], Koo, KC[Koo, Kyoung-Choul], Cho, JH[Cho, Jong-Hyun], Kim, HG[Kim, Hee-Gon], Kim, Joung-Ho, Lee, JH[Lee, Jun-Ho], Lee, HD[Lee, Hyung-Dong], Park, KW[Park, Kun-Woo], Pak, JS[Pak, Jun-So]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201212

113

Electromagnetic interference shielding effectiveness of monolayer graphene
Hong, SK[Hong, Seul Ki], Kim, KY[Kim, Ki Yeong], Kim, TY[Kim, Taek Yong], Kim, JH[Kim, Jong Hoon], Park, SW[Park, Seong Wook], Kim, Joung Ho, Cho, Byung Jin
NANOTECHNOLOGY, 201211

114

Measurement and Analysis of a High-Speed TSV Channel
Kim, HG[Kim, Hee-Gon], Cho, JH[Cho, Jong-Hyun], Kim, MH[Kim, Myung-Hoi], Kim, KY[Kim, Ki-Yeong], Lee, JH[Lee, Jun-Ho], Lee, HD[Lee, Hyung-Dong], Park, KW[Park, Kun-Woo], Choi, KS[Choi, Kwang-Seong], Bae, HC[Bae, Hyun-Cheol], Kim, Joung-Ho, Kim, JS[Kim, Ji-Seong]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201210

115

Vertical Inductive Bridge EBG (VIB-EBG) Structure With Size Reduction and Stopband Enhancement for Wideband SSN Suppression
Kim, MH[Kim, Myung-Hoi], Koo, KC[Koo, Kyoung-Choul], Kim, Joung-Ho, Kim, JS[Kim, Ji-Seong]
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 201208

116

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs
Kim, MH[Kim, Myung-Hoi], Koo, KC[Koo, Kyoung-Choul], Hwang, CS[Hwang, Chul-Soon], Shim, YJ[Shim, Yu-Jeong], Kim, Joung-Ho, Kim, JH[Kim, Jong-Hoon]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201206

117

Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects
Cho, JH[Cho, Jeonghyeon], Song, EH[Song, Eak-Hwan], Kim, HG[Kim, Hee-Gon], Ahn, SY[Ahn, Seung-Young], Pak, JS[Pak, Jun-So], Kim, JS[Kim, Ji-Seong], Kim, Joung-Ho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201108

118

Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances
Kim, J[Kim, Jingook], Fan, J[Fan, Jun], Ruehli, AE[Ruehli, Albert E.], Kim, Joungho, Drewniak, JL[Drewniak, James L
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 201108

119

An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor
Hwang, CS[Hwang, Chul-Soon], Shim, YJ[Shim, Yu-Jeong], Koo, KC[Koo, Kyoung-Choul], Kim, MH[Kim, Myung-Hoi], Pak, JS[Pak, Jun-So], Kim, Joung-Ho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 201108

120

Towards Gigahertz Operation: Ultrafast Low Turn-on Organic Diodes and Rectifiers Based on C-60 and Tungsten Oxide
Im, DM[Im, Dong-Mo], Moon, HU[Moon, Han-Ul], Shin, MC[Shin, Min-Chul], Kim, Joung-Ho, Yoo, SH[Yoo, Seung-Hyup]
ADVANCED MATERIALS, 201102