Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards

Modeling and measurement of mode-conversion and frequency dependent loss in high-speed differential interconnections on multilayer PCB

Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates

High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions

Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS

Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole

Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission

Power distribution networks for system-on-package: Status and challenges

Electrical properties and ultrafast photo-response of InGaAs/InP grown by low-temperature molecular beam epitaxy with a GaAs decomposition source