발행물

전체 논문

217

171

An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards
Kim Y.-J., Yoon H.-S., Lee S., Moon G., Wee J.-K., Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200402

172

Suppression of GHz, range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs
Kim, H, Sun, BK, Kim, Joungho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200402

173

A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise
Kam, DG, Lee, H, Kim, Joungho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200309

174

Efficient on-chip decoupling capacitor design on an 8-bit microcontroller to reduce simultaneous switching noise and electromagnetic radiated emission
Kim, Joungho, Kim, H
IEICE TRANSACTIONS ON COMMUNICATIONS, 200306

175

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer
Ahn, S[Ahn, Seungyoung], Lee, J[Lee, Junho], Kim, Joungho, Ryu, W[Ryu, Woonghwan], Kum, BH[Kum, Byung-Hun], Choi, HS, Yoon, CK
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200302

176

Characterization of picosecond electric-pulse propagation on CPW components by transient near-field mapping
Lee, J, Yu, S, Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200208

177

Microwave frequency interconnection line model of a wafer level package
Lee, J, Ryu, W, Kim, Joungho, Kim, N, Pak, J, Kim, JM
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200208

178

Unit cell approach to full-wave analysis of meander delay line using FDTD periodic structure modeling method
Lee, H., Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200205

179

Microwave frequency crosstalk model of redistribution line patterns on wafer level package
Sung, M., Kim, N., Lee, J., Kim, H., Choi, B.K., Kim, J.-M., Hong, J.-K., Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200205

180

Over GHz low-power RF clock distribution for a multiprocessor digital system
Ryu W., Wai A.L.C., Wei F., 10082593, Lai W.L.
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200202