발행물

전체 논문

217

181

Picosecond time-domain characterization of CPW bends using a photoconductive near-field mapping probe
Lee, J, Kim, J, Yu, S, Kim, Joungho
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 200111

182

Pulse-coupling measurement of coupled microstrip lines using a micromachined picosecond optical near-field probe
Lee, J, Lee, H, Baek, S, Jeong, YC, Kim, Joungho
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 200110

183

Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection
Kim, N, Sung, M, Kim, H, Baek, S, Ryu, W, An, JG, Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200108

184

Picosecond-domain radiation pattern measurement using fiber-coupled photoconductive antenna
Lee, H, Lee, J, Kim, Joungho
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2001

185

A micromachined photoconductive near-field probe for picosecond pulse propagation measurement on coplanar transmission lines
Lee, J, Lee, H, Yu, S, Kim, Joungho
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2001

186

High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm
Ryu, W[Ryu, Woonghwan], Yim, MJ[Yim, Myung-Jin], Ahn, S[Ahn, Seungyoung], Lee, J[Lee, Junho], Kim, W[Kim, Woopoung], Paik, Kyung-Wook, Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 200009

187

Embedded microstrip structures of on-chip and MCM-Si interconnection lines for Giga-Hertz digital signal Transmission
Kim, Joung-Ho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200008

188

RF interconnect for multi-Gbit/s board-level clock distribution
Ryu, W[Ryu, Woonghwan], Lee, J[Lee, Junwoo], Kim, H[Kim, Hyungsoo], Ahn, S[Ahn, Seungyoung], Kim, N[Kim, Namhoon], Choi, B[Choi, Baekkyu], Kam, D[Kam, Donggun], Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200008

189

Embedded microstrip interconnection lines for gigahertz digital circuits
Ryu, W, Baik, SH, Kim, H, Kim, J, Sung, MH, Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200008

190

An efficient crosstalk parameter extraction method for high-speed interconnection lines
Sung, M., Ryu, W., Kim, H., Kim, J., Kim, Joungho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 200005