발행물

전체 논문

217

121

Special Section on Through Silicon Vias Foreword
Kam, DG[Kam, Dong Gun], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201102

122

A Wideband and Compact Partial Electromagnetic Bandgap Structure With a Narrow Via Pitch for a Signal Via Shield
Hwang, CS[Hwang, Chul-Soon], Kim, JM[Kim, Jae-Min], Song, EH[Song, Eak-Hwan], Shim, YJ[Shim, Yu-Jeong], Kim, Joung-Ho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201102

123

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Cho, JH[Cho, Jong-Hyun], Song, EH[Song, Eak-Hwan], Yoon, KH[Yoon, Ki-Hyun], Pak, JS[Pak, Jun-So], Kim, JH[Kim, Joo-Hee], Lee, WJ[Lee, Woo-Jin], Song, TG[Song, Tai-Gon], Kim, KY[Kim, Ki-Yeong], Lee, JH[Lee, Jun-Ho], Lee, HD[Lee, Hyung-Dong], Park, KW[Park, Kun-Woo], Yang, ST[Yang, Seung-Taek], Suh, MS[Suh, Min-Suk], Byun, KY[Byun, Kwang-Yoo], Kim, Joung-Ho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201102

124

Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays
Kim, J[Kim, Jingook], Shringarpure, K[Shringarpure,, Fan, J[Fan, Jun], Kim, Joungho, Drewniak, JL[Drewniak, James L
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 201102

125

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
Kim, JH[Kim, Joo-Hee], Pak, JS[Pak, Jun-So], Cho, JH[Cho, Jong-Hyun], Song, EH[Song, Eak-Hwan], Cho, JH[Cho, Jeong-Hyeon], Kim, HG[Kim, Hee-Gon], Song, TG[Song, Tai-Gon], Lee, JH[Lee, Jun-Ho], Lee, HD[Lee, Hyung-Dong], Park, KW[Park, Kun-Woo], Yang, ST[Yang, Seung-Taek], Suh, MS[Suh, Min-Suk], Byun, KY[Byun, Kwang-Yoo], Kim, Joung-Ho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201102

126

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
Pak, JS[Pak, Jun-So], Kim, JH[Kim, Joo-Hee], Cho, JH[Cho, Jong-Hyun], Kim, KY[Kim, Ki-Yeong], Song, TG[Song, Tai-Gon], Ahn, SY[Ahn, Seung-Young], Lee, JH[Lee, Jun-Ho], Lee, HD[Lee, Hyung-Dong], Park, KW[Park, Kun-Woo], Kim, Joung-Ho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201102

127

Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package
Koo, KC[Koo, Kyoung-Choul], Shim, YJ[Shim, Yu-Jeong], Yoon, CW[Yoon, Chang-Wook], Kim, JM[Kim, Jae-Min], Yoo, JS[Yoo, Jeong-Sik], Pak, JS[Pak, Jun-So], Kim, Joung-Ho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 201008

128

Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method
Kim, JM[Kim, Jae-Min], Lee, WJ[Lee, Woo-Jin], Shim, YJ[Shim, Yu-Jeong], Shim, JJ[Shim, Jong-Joo], Kim, KY[Kim, Ki-Yeong], Pak, JS[Pak, Jun-So], Kim, Joung-Ho
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 201008

129

Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure
Shim, J[Shim, Jongjoo], Kam, DG[Kam, Dong Gun], Kwon, JH[Kwon, Jong Hwa], Kim, Joungho
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201008

130

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects
Li, EP[Li, Er-Ping], Wei, XC[Wei, Xing-Chang], Cangellaris, AC[Cangellaris, A, Liu, EX[Liu, En-Xiao], Zhang, YJ[Zhang, Yao-Jiang], D``Amore, M[D`Amore, Marcello], Kim, Joungho, Sudo, T[Sudo, Toshio]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201005