발행물

전체 논문

217

71

Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s
Jeon, Y[Jeon, Yeseul], Kim, H[Kim, Heegon], Kim, Joungho, Je, M[Je, Minkyu]
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 201807

72

Miniaturized and high-performance RF packages with ultra-thin glass substrates
Kim, MS[Kim, Min Suk], Pulugurtha, MR[Pulugurtha, Mar, Kim, Y[Kim, Youngwoo], Park, GY[Park, Gap Yeol], Cho, K[Cho, Kyungjun], Smet, V[Smet, Vanessa], Sundaram, V[Sundaram, Venky], Kim, Joungho, Tummala, R[Tummala, Rao]
MICROELECTRONICS JOURNAL, 201807

73

Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System
Kim, Joungho, Park, S[Park, Shinyoung], Song, J[Song, Jinwook], Kim, S[Kim, Subin], Kim, Y[Kim, Youngwoo], Lee, MH[Lee, Man Ho]
IEEE Transactions on Components, Packaging and Manufacturing Technology, 201804

74

High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications
Cho,J[Cho, Yeonje], Kim, M[Kim, Minsik], Choi, BH[Choi, Bo H.], Lee, KR[Lee, Kwy-Ro], Cho, GH[Cho, Gyu-Hyeong], Rim, Chun T.[Rim, Chun Taek], Kim, Joungho, Kim, MW[Kim, Min Woo], Kim, J[Kim, Jihoon]
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 201801

75

Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures
Piersanti, S[Piersanti, Stefan, de Paulis, F[de Paulis, France, Olivieri, C[Olivieri, Carlo], Jung, DH[Jung, Daniel Hyunsuk], Kim, Joungho, Orlandi, A[Orlandi, Antonio]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201710

76

Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling
Kim, Y[Kim, Youngwoo], Cho, J[Cho, Jonghyun], Cho, K[Cho, Kyungjun], Park, J[Park, Junyong], Kim, S[Kim, Subin], Kim, DH[Kim, Dong-Hyun], Park, G[Park, Gapyeol], Sitaraman, S[Sitaraman, Srikri, Raj, PM[Raj, Pulugurtha Markon, Tummala, RR[Tummala, Rao R.], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201709

77

Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules
Sitaraman, S[Sitaraman, Srikri, Sukumaran, V[Sukumaran, Vijay], Pulugurtha, MR[Pulugurtha, Mar, Wu, ZH[Wu, Zihan], Suzuki, Y[Suzuki, Yuya], Kim, Y[Kim, Youngwoo], Sundaram, V[Sundaram, Venky], Kim, Joungho, Tummala, RR[Tummala, Rao R.]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201709

78

Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact
Kim, Joungho, Kim, JJ[Kim, Jonghoon J.], Kim, HG[Kim, Hee-Gon], Jung, DH[Jung, Daniel Hyunsuk], Choi, S[Choi, Sumin], Lim, J[Lim, Jaemin], Kim, Y[Kim, Youngwoo], Park, J[Park, Junyong], Kim, H[Kim, Hyesoo], Ha, D[Ha, Dongho], Bae, M[Bae, Michael]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201708

79

Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis
Piersanti, S[Piersanti, Stefan, Pellegrino, E[Pellegrino, Enza, de Paulis, F[de Paulis, France, Orlandi, A[Orlandi, Antonio], Jung, DH[Jung, Daniel Hyunsuk], Kim, DH[Kim, Dong-Hyun], Kim, Joungho, Fan, J[Fan, Jun]
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 201708

80

High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package
Kim, H[Kim, Hyesoo], Kim, JJ[Kim, Jonghoon J.], Park, J[Park, Junyong], Park, S[Park, Shinyoung], Choi, S[Choi, Sumin], Bae, B[Bae, Bumhee], Ha, D[Ha, DongHo], Bae, M[Bae, Michael], Kim, Joungho
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201708