발행물
컨퍼런스
제2회 한국소재표면기술컨퍼런스 안산
2020
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A Study on the Cobalt Electrodeposition for High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive
16th International Symposium on Novel and Nano Materials
Study of Driving Force for Cu to Cu Direct Bonding at Low Temperature
Selective Cu Electrodeposition on sub-micrometer trenches Using microcontact printing and Additives.
Synthesis of NiWP Coated Diamonds Particles with Enhanced Mechanical and Anti Corrosion Property for Diamond Wire Sawing Process
Study of Electrodeposited copper telluride and its thermoelectric properties