발행물
컨퍼런스
ENGE2018
2018
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Fabrication of Thin Film p-Si using Electrodeposition Assisted Stripping (EAS) Method for Humidity sensor
Electrochemical Polishing of Cu Overburden for Redistribution Layer Process of Fan-Out Wafer Level Packaging
ISMP 2018
Effect of Additive on High Aspect Ratio Cu Deep Via
ECS
Study of the Cl- ion sensor based on Ag nanoparticle-decorated multi-walled carbon nanotubes and CuBTC
Pulse Electrodeposition of Cu through-Silicon-Via (TSV) with Surface Suppressor