발행물
컨퍼런스
2019 ECS spring
2019
,
A Effect of Halide on Cobalt Electrodeposition for through-silicon-via (TSV) application
한국반도체학술대회
단일 첨가제를 이용한 코발트 TSV Bottom-up filling에 대한 연구
Low Temperature Cu-Cu direct Bonding
한국반도체디스플레이기술학회 추계학술대회
2018
Low Temperature electroplated Cu-Cu bonding
A study on the Cchloride ion sensors based on Ag nanoparticles-decorated multi-walled carbon nanotubes and CuBTC