DDR4 Ball Grid Array package intermittent fracture effect on signal integrity

Temperature Estimation of HBM2 Channels with Tail Distribution of Retention Errors in FPGA-HBM2 Platform

Divulge of Root Cause Failure in Individual Cells of 2x nm Technology DDR4 DRAM at Operating Temperature

Estimation of the Trap Energy Characteristics of Row Hammer-Affected Cells in Gamma-Irradiated DDR4 DRAM

Exploitations of Multiple Rows Hammering and Retention Time Interactions in DRAM Using X-Ray Radiation

Fault Coverage Re-Evaluation of Memory Test Algorithms With Physical Memory Characteristics

DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball

DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package

A theoretical and experimental investigation of Bragg's rule for energy-loss straggling in low mean energy loss regime in air and its constituents

FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor