발행물
컨퍼런스
The Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) 2021
2021
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Study on uniform deposition on 300 mm silicon wafer with sub-100 nm sized particles for cleaning application
Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol
Ultrafine Particle Removal in the Wafer Cleaning Process Using an Aqueous Solution with a High Concentration of Dissolved O3 and HF
Effect of Viscosity on Ceria Abrasive Removal in the Buffing CMP Process
2021 한국진공학회 동계정기학술대회
Effects of etch back on Cell for an Advanced Vertical NAND manufacturing process using gas reactor