2016

,

Warpage Analysis Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package

2015

,

Flexibility limits of ITO electrode devices and effect of hard coating layer on mechanical for flexible electronic devices

2015

,

Foldable metal-grid transparent electrode using electrohydrodynamic jet printing

2015

,

Thermal and Fatigue Analysis of IGBT Module Package for Electronic Locimotive Power Control Unit Using Numerical Analysis

2015

,

Reliability Analysis of Flip Chip Package with Copper Pillar Bump