2016

,

Effects of Substrate Types and Copper Bump Shape on Low-k Layer Stress for a Flip-Chip Chip Size Package (fcCSP)

2016

,

Development of Surface Acoustic Wave Strain Sensor as a Tire Deformation Monitoring Sensor

2016

,

Experimental and Numerical Analysis of Protrusion of a Copper-Nickel Alloy in a Through-Silicon Via

2016

,

Experimental Investigation of Flexibility and Mechanical Properties of Ultra-Stretchable Ecoflex Substrate

2016

,

Flexible Transparent Multi-Touch and Pressure Sensor Using AgNW/PEDOT:PSS Hybrid Film