발행물
컨퍼런스
International Symposium on Microelectronics and Packaging
2017
,
Experimental Investigation of Electrical and Mechanical Properties of Stretchable Textile Electrodes
Highly Stretchable Ag Paste Interconnector Using Fast Infrared Curing Technology
Numerical Reliability Analysis of Thermal Compression Bonding and Laser Assited Bonding for Flip Chip Package
Sensitivity Controllable Stretchable Strain Sensor for Wearable Devices
Stretchable and printable electrode based on Ag-Ecoflex composite