발행물
컨퍼런스
성균관대, KAIST, 국민대, 서울대, 연세대, 한양대, 충주대, 동아대, 부산대, 금오 공대 등
1970
,
MEMS Packaging & Reliability 관련 세미나
2018 20th Electronics Packaging Technology Conference
2018
Highly Stretchable, Durable, and Printable Textile Conductor
Numerical analysis of laser thermal compression bonding for flip chip package
The 17th International Symposium on Microelectronics and Packaging
Stretchable Radio-Frequency Antennas Based on Highly Conductive Silver Paste
Study of mass reflow, laser reflow and laser TCB for flip chip package by numerical analysis