발행물
컨퍼런스
The 17th International Symposium on Microelectronics and Packaging
2018
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The Electromechanical Properties of Highly Stretchable, Durable, and Printable Textile Electrode
Development of printable stretchable strain sensor for smart gloves
2018 IEEE 68th Electronic Components and Technology Conference
Controlling die warpage by applying under bump metallurgy for fan-out package process applications
Electro-mechanical properties of screen printed stretchable electrode using laser curing method
International Symposium on Microelectronics and Packaging
2017
Barrier Performance and Flexibility of Single SiNx film Deposited by Plasma Enhanced Chemical Vapor Deposition