발행물
컨퍼런스
1st International Conference on Abrasive Processes
2008
,
Mechanical Effect of Abrasive in Copper Chemical Mechanical Planarization
UCPSS 2008
The Effect of PVA Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection
한국전기전자재료학회 2008 하계학술대회
Cu CMP에서 Corrosion Inhibitor에 의한 연마 특성 분석
17th World Interfinish Congress
Effect of Native Oxide on Polycrystalline Silicon CMP
Effect of Additive in Chemical Mechanical Polishing Using Potassium Hydroxide-Hydrogen Peroxide Based Slurry for LiTaO3 Substrate