발행물
컨퍼런스
International Symposium on Green Manufacturing and Applications (ISGMA 2014)
2014
,
Empirical Removal Rate Model of Mixed Abrasive Slurry on Oxide CMP
2014년도 한국윤활학회 제 58회 춘계학술대회
대면적 기판 CMP를 위한 OSCAR형 연마기의 기구학적 운동해석
Joint Symposium of International Workshop on Piezoelectric Materials and Applications in Actuators (IWPMA 2009)
2009
Chemical Mechanical Polishing of Ti-Si-N nanocomposite for AFM study
2008 International Conference on Planarization/CMP Technology
2008
Reduction of Dishing in Two-step Copper CMP by Using High SiO2-to-Cu Selectivity Slurry
1st International Conference on Abrasive Processes
Effect of corrosion inhibitor on surface characteristics of copper chemical mechanical planarization