발행물
컨퍼런스
TMS 2014 143rd Annual Meeting
2014
,
Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate
Materials Research Society Fall Meeting
2013
Adhesion Characteristic of Graphene Synthesized on Cu
2013 KSPE Fall Meeting
Research for Mechanical Reliability Improvement of Silver Nanoparticle Thin Films
Tensile Testing of Ultra-Thin Films using Water Surface
Research on the adhesion change of Gr/Cu interface under vacuum environment