발행물
컨퍼런스
2012년도 대한기계학회 마이크로/나노공학부문 춘계학술대회
2012
,
용액공정 기반 은 나노입자 박막의 유기 잔여물에 의한 계면 접합 강화
IEEE International 3D System Integration Conference
Mechanical Reliability of Cu/Low-k Interconnects and Underfill
KSPE 2011 Autumn Conference
2011
Bonding Reliability of Silver Nanoparticles
KSPE 2011 Spring Conference
Development of Inclined Conductive Bump for Electronic Packaging
2011 61st Electronic Components and Technology Conference, ECTC 2011
Development of inclined conductive bump (ICB) for flip-chip interconnection