발행물
컨퍼런스
2008 IEEE International Interconnect Technology Conference
2008
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Quantitative Roadmap for Optimizing CMP of Ultra-Low-k Dielectrics
Levitronix CMP Users Conference
Optimized CMP of Ultra-Low-k Dielectrics
NCCAVS CMPUG
2010
Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films
The 10th International Symposium on Microelectronics and Packaging
2011
Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill
The 61st Electronic Components and Technology Conference
Development of Inclined Conductive Bump (ICB) for Electronic Packaging