Non-Uniform UV Curing Effects on Mechanical and Fracture Properties of Organosilicate Low-k Thin Films

2007

Optimizing Solution Chemistry for Reduced Damage during CMP

2007

Solution Chemistry Effects on Cracking and Damage during CMP

2007

Stress and Slurry Chemistry Effects on Cracking and Damage Evolution during CMP: Implications for Next Technology Nodes

2007

13th International Conference on Chemical-Mechanical Polish Planarization (CMP) for ULSI Multilevel Interconnection (CMP-MIC)

2008