발행물
컨퍼런스
Materials Research Society 2011 Spring Meeting
2011
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Functionally Graded Hybrid Layers for High-Performance Polymer/Silicon Adhesion
Korea-SV Electronics Packaging Technology Workshop
2010
Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill
2010 NCCAVS CMPUG
Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films
Proceedings of Stress-Induced Phenomena in Metallization: 11th International Workshop
Cohesive Toughness of Low-k Film with Periodically Changing Elastic Modulus: Cube-Corner Indentation
215th Electrochemical Society Meeting
2009
Optimized CMP of Nanomaterials