발행물
컨퍼런스
2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
,
Hybrid modeling and analysis of power supply noise effects on analog-to-digital converter considering hierarchical PDNs
IEEE 7th Workshop on Signal Propagation on Interconnects
3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB
2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC
A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics
Analysis of power distribution network in TSV-based 3D-IC