발행물
컨퍼런스
2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010
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A designated clock generation and distribution (DCGD) chip scheme for substrate noise-free 3-D stacked SiP design
2009 11th Electronic Packaging Technology Conference, EPTC 2009
Modeling and analysis of die-to-die vertical coupling in 3-D IC
Analysis of power/ground noise effect on performance degradation of analog-to-digital converter
Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer
2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
Precise analysis and modeling of far-end crosstalk and far-end crosstalk saturation using mode analysis in coupled microstrip lines