발행물
컨퍼런스
IEEE Electronics Packaging Technology Conference, EPTC
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Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board
20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009
Characterization of on-chip Interconnections and capacitive coupling effect on CMOS operational amplifier
Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter
Vertical electromagnetic bandgap structure for noise suppression in single-ended and differential signaling on a multi-layer backplane board
EMC Kyoto Symposium
An On-Chip Spectrum Analyzer for Signal Integrity