발행물
컨퍼런스
2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
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Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)
A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS `09
Extraction of equivalent inductance in package-PCB hierarchical power distribution network
Through silicon via (TSV) equalizer
A precise analytical eye-diagram estimation method for non-ideal high-speed channels