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Active Shield to Minimize Magnetic Flux Density for On-Line Electric Vehicle(OLEV) Application

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Guard ring effect for Through Silicon Via (TSV) noise coupling reduction

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Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

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Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter

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Suppression of power/ground noise using Meshed-Planar Electromagnetic Bandgap (MP-EBG) structure for Ultra-Wideband (UWB) system-in-package (SiP)