발행물
컨퍼런스
2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
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Through Silicon Via (TSV) shielding structures
Design Con 2010
Passive Equalizer Design Using Defected Ground Structure on PCBs
2012 International Microelectronics and Packaging Society
Measurement-based Signal Quality Test of High-speed TSV Channel
3rd Electronics System Integration Technology Conference, ESTC 2010
TSV modeling and noise coupling in 3D IC
EMC Europe 2010
An Analog Switching (Non PWM) High Power Inverter for EMI Suppression in On-Line (OLEV)