발행물
컨퍼런스
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS `09
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Active circuit to through silicon via (TSV) noise coupling
Hybrid equalizer design for 12.5 Gbps serial data transmission
14th International Symposium of Robotic Research, ISRR 2009
Robust 3-D visual SLAM in a large-scale environment
2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009
Analytical modeling of power distribution network with embedded electromagnetic bandgap structure
2009 Korea-Japan Joint Conference
On-Chip PDN (Power Distribution Network) Comparison between Single Chip and Stacked Multi-Chips with TSV (Through Silicon Via)