2016DNPU
TechnologyChip SizePower SupplyFunctionOperating FrequencyPower ConsumptionReleased Date65nm 1P8M CMOS4mm x 4mm (16㎟)0.77V ~1.1VVGeneral Purpose Deep Neural-network Processor50MHz ~ 200MHz34.6mW (50MHz @0.77V), 279mW (200MHz @1.1V)Aug. 2016
2016WIT
TechnologyChip SizePower SupplyFunctionPower ConsumptionReleased Date65nm Triple-Well CMOS TechnologySensor: 1.1mm x 2.9mm, Hub: 1.4mm x 0.9mm1.2V3D Lung Electrical Impedance Tomography6.96mWAug. 2016
2015BRAIN
TechnologyChip SizePower SupplyFunctionOperating FrequencyPower ConsumptionReleased Date65nm Triple-Well CMOS Technology4mm x 4mm0.55V ~ 1.2VUltra-Low-Power Robot AI Processor(Tree Search + Reinforcement Learning)7MHz ~ 245MHz1.1mW ~ 151mWJul. 2015
2015AutoBrain
TechnologyChip SizePower SupplyFunctionOperating FrequencyPeak performancePower Consumptionpower efficiencyenergy efficiencyReleased Date65nm 1P8M CMOS Process4.0mm x 4.0mm1.2V (Nominal), 0.65V~1.2V (DVFS)Intelligent ADAS & Real-time SGM250MHz (Nominal), 50MHz~250MHz (DVFS)502GOPS330mW (avg.), 582mW (peak)862GOPS/W31.4GOPS/mm2July 2015
2015MoST
TechnologyChip SizePower SupplyFunctionKey BlockPower ConsumptionReleased Date0.18 μm 1P6M CMOS Process2.35 mm x 5.0 mm1.5V, 5VSticker-type SpO2 / ExG Monitoring SystemOLED Driver, OPD Sensor Front-end, Optical Calibration Loop, Clock Broadcasting TRx141μW ~ 1300μWAug. 2015
2015NINE-X
TechnologyChip SizePower SupplyFunctionKey BlockPower ConsumptionReleased Date65 nm 1P8M CMOS Process4.0 mm x 4.0 mm0.5~1.2VNatural User Interface & Experience for HMDDLE, DIE, TRNG, SSC, HSC, GRE126.1mWAug. 2015
2014EEG-Connectome Chip
TechnologyChip SizePower SupplyFunctionChannel FrequencyPower ConsumptionReleased Date0.18 μm CMOS Process1.0 mm x 3.8 mm1.8VEEG-Connectome Processing20MHz1.71mWDec. 2014
2014BONE-AR
TechnologyChip SizePower SupplyFunctionInjection MethodInjectable CurrentFrame RatePower ConsumptionReleased Date0.18 μm 1P6M CMOS Technology2.5 mm x 3.8 mm (including pads)1.5 VElectrical Impedance Tomography (EIT)Dual Frequency Division Multiplexing125-500μAp-p (10~360kHz)30fps4.84mWDec. 2014
2014M3H
TechnologyChip SizePower SupplyFunctionKey AcceleratorsPower ConsumptionReleased Date0.11 μm Dongbu CMOS Process3.375 mm x 2.25 mm1.2V, 3.3VMultimodal Mental Management System ICElectroencephalography sensor, Near-infrared Spectroscopy sensor24mW @ maximum conditionAug. 2014
2014DMLP
TechnologyChip SizePower SupplyFunctionKey BlockPower ConsumptionReleased Date65 nm 1P8M CMOS Process2.5 mm x 4.0 mm1.2VDeep Learning and InferenceDLE, DIE, TRNG185.3mWAug. 2014