2014Biocle A
TechnologyChip SizePower SupplyFunctionModulationChannel FrequencySensitivityPower ConsumptionReleased Date65nm CMOS Technology1.8 mm x 3.2 mm1.2VBody Channel Communication TransceiverBPSK, OOK40MHz(40MHz BW), 160MHz(40MHz BW), 13.56MHz(100kHz BW)-58dBm @ 80Mb/s, -72dBm @ 100kb/s79pJ/b, 42.5μWAug. 2014
2014NT-FMP
TechnologyChip SizeFunctionSupply VoltagePower ConsumptionOperating FrequencyReleased Date65 nm CMOS Process4 mm x 0.5 mmUltra-low-power Object Matching Processor0.5V(Logic), 0.8V(SRAM)54μW5MHz
2014Gaze Image Sensor (GIS)
TechnologyChip SizePower SupplyFunctionFrequencyPeak PerformancePower ConsumptionReleased Date65 nm 1P8M CMOS Process3.36 mm x 3.36 mm2.5V (Pixel), 1.2V (Other)Gaze Image Sensor50MHz0.3 GOPS10mW(Average), 34mW(Peak)Jun. 2014
2014Object Recognition Processor (ORP)
TechnologyChip SizePower SupplyFunctionFrequencyPeak PerformancePower ConsumptionReleased Date65 nm 1P8M CMOS Process4.0 mm x 4.0 mm1.2V (Normal), 0.7V~1.2V(DVFS)Object Recognition50MHz(DGP), 100MHz(FDP/SSP/FMP),200MHz(CNNP/DRMP/EOGP/FA/NoC)151 GOPS65mW(Average), 97mW(Peak)Jun. 2014
2013MSM
TechnologyChip SizePower SupplyFunctionKey AcceleratorsPower ConsumptionReleased Date0.13 μm 1P8M CMOS Process2.35 mm x 5.0 mm3.3V(IO), 0.7-1.0V(Core)EEG Signal Processing, Transcranial Electrical StimulationIndependent Component Analysis (ICA), Fast Fourier Transform (FFT),Support Vector Machine (SVM)4.45mWAug. 2013
2013Gluco Scope2
TechnologyChip SizePower SupplyFunctionKey BlockPower ConsumptionReleased Date0.18um 1P6M CMOS Process2.5 mm x 5.0 mm (including pads)1.5VNon-invasive Blood Glucose Level EstimationImpedance Spectroscopy Circuit,Multi-wavelength Near-infrared Spectroscopy CircuitMaximum 38mWAug. 2013
2013Biocle5
TechnologyChip SizePower SupplyFunctionModulationChannel FrequencySensitivityPower ConsumptionReleased Date0.13 μm CMOS Technology2.5 mm x 5.0 mm1.2 VHuman Body Communication (HBC) Network CoordinatorFrequency Selective Digital Transmission (FSDT)21 MHz (5.25 MHz Bandwidth)-98 dBm @ 124 kbps33 μW/nodesAug. 2013
2013SEIT
TechnologyChip SizePower supplyFunctionSensitivityInjectable CurrentTHDPower ConsumptionReleased Date0.18 μm 1P6M CMOS Technology2.5 mm x 5.0 mm1.8 VElectrical Impedance Tomography (EIT)4.9 mΩ10-400 μAp-p (0.1-100 kHz)0.2% @ 200 μAp-p53.4 mW (USB Supply)Aug. 2013
2013BONE-AR
TechnologyChip SizeFunctionFrequency(Nominal)Peak PerformancePower DissipationArea EfficiencyPower EfficiencyPer-frame EnergyReleased Date65nm 1P8M CMOS Process4.0 mm x 8.0 mmMarkerless Augmented Reality250 MHz (Digital)1.22 TOPS381 mW38.13 GOPS/mm21.57 TOPS/W12.70 mJ/frameJun. 2013
2012BONE-V6
TechnologyChip SizeFunctionFrequency(Nominal)Peak PerformancePower DissipationArea EfficiencyPower EfficiencyPer-pixel EfficiencyReleased Date0.13 μm 1P8M Mixed-mode CMOS Process5.0 mm x 5.0 mmContext-Aware Object Recognition200 MHz (Digital)271.4 GOPS260 mW10.86 GOPS/mm2646 GOPS/W9.4 nJ/PixelAug. 2012