SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Signal Integrity
Interposer Design
High Bandwidth Memory
발행물
컨퍼런스
Jonghyun Cho, Kiyeong Kim, Heegon Kim, Srikrishna Sitaraman, Venky Sundaram, Rao Tummala and Joungho Kim
2014
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Analysis and Optimization of a Power Distribution Network in 2.5D IC with Glass Interposer
Eunseok Song, Daniel H. Jung, Youngwoo Kim, and Joungho Kim
Measurement and Analysis of Wireless Power Distribution Network using Magnetic Field Resonance in 3D Package and IC
Youngwoo Kim, Kiyeong Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala and Joungho Kim
Analysis of Power Distribution Network in Glass, Silicon Interposer and PCB
Heegon Kim, Hyunsuk Lee, Jonghyun Cho, Youngwoo Kim, and Joungho Kim
Electrical Design of silicon, glass and organic interposer channels
Jonghyun Cho, Youngwoo Kim, Venky Sundaram, Rao Tummala, and Joungho Kim
2013
Analysis of Glass Interposer PDN and Proposal of PDN Resonance Suppression Methods