SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Signal Integrity
High Bandwidth Memory
Electromagnetic Compatibility
발행물
컨퍼런스
Youngwoo Kim, Kiyeong Kim, Jonghyun Cho, and Joungho Kim
2015
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Power Distribution Network Design and Optimization based on Frequency Dependent Target Impedance
Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala and Joungho Kim
Noise Coupling Modeling and Analysis of Through Glass Via(TGV)
Jihye Kim, Insu Hwang, Youngwoo Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala, and Joungho Kim
Precise RLGC Modeling and Analysis of Through Glass Via(TGV) for 2.5D/3D IC
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Venky Sundaram, Rao Tummala and Joungho Kim
Signal and Power Integrity Analysis in 2.5D Integrated Circuits (ICs) with Glass, Silicon and Organic Interposer
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Srikrishna Sitaraman, Venky Sundaram, Rao Tummala and Joungho Kim
Analysis and Optimization of a Power Distribution Network in 2.5D IC with Glass Interposer
