SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Electromagnetic Compatibility
Signal Integrity
Reinforcement Learning
발행물
컨퍼런스
66th Electronic Components and Technology Conference (ECTC)
2016
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Passive Equalizer for High Bandwidth Memory (HBM) with 30Gbps Data Transmission
DesignCon 2016
Design of a Mobile AP GPU PDN based on Chip Power Model and Measurement
IEEE Electrical Design of Advanced Packaging & System Symposium
2015
Analysis of through glass via (TGV) noise coupling effect to Noise Figure of 2.4GHz LNA on glass interposer
Michael Bae, and Joungho Kim
Analysis of External Force Dependent Lumped RLGC Model of High-bandwidth and High-density Silicone Rubber Socket
Kyungjun Cho, Hyunsuk Lee, Heegon Kim, Sumin Choi, Youngwoo Kim, Jaemin Lim and Joungho Kim
Design Optimization of High Bandwidth Memory (HBM) Interposer considering Signal Integrity