SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Electromagnetic Compatibility
Interposer Design
Signal Integrity
발행물
전체 논문
44
1
Policy-based Reinforcement Learning (RL) for Through Silicon Via (TSV) Array Design in High Bandwidth Memory (HBM) Considering Signal Integrity (SI)
Kunwoo Kim, Hyunwook Park, Seongguk Kim, Youngwoo Kim, Kyungjune Son, Daehwan Lho, Keeyoung Son, Taein Shin, Boogyo Sim, Joonsang Park, Shinyoung Park, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024
2
Bayesian Exploration Imitation Learning-Based Contextual via Design Optimization Method of PAM-4-Based High-Speed Serial Link
Jihun Kim, Minsu Kim, Haeyeon Kim, Hyunwook Park, Seonguk Choi, Joonsang Park, Boogyo Sim, Keeyoung Son, Seongguk Kim, Jinwook Song, Youngwoo Kim, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2023
3
Accelerated Statistical Eye Diagram Estimation Method for Efficient Signal Integrity Analysis
Junyong Park, Youngwoo Kim, Donghyun Kim
IEEE Access, 2023
4
Deep Reinforcement Learning-based Optimal and Fast Hybrid Equalizer Design Method for High-bandwidth Memory (HBM) Module
Seonguk Choi, Keeyoung Son, Hyunwook Park, Seongguk Kim, Boogyo Sim, Jihun Kim, Joonsang Park, Minsu Kim, Haeyeon Kim, Jinwook Song, Youngwoo Kim, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023
5
Electrical Performance Analysis of High-speed Interconnection and Power Delivery Network (PDN) in Low-loss Glass Substrate-based Interposers
Youngwoo Kim
Micromachines, 2023
6
A Statistical Approach for Signal and Power Integrity Co-Design in High-speed Interconnects Considering Non-linear Power/Ground Noise and Bit-patterns
Youngwoo Kim
Micromachines, 2023
7
ects Considering Non-linear Power/Ground Noise and Bit-patterns
Youngwoo Kim
Micromachines, 2023
8
Evaluation of Statistical Fault Analysis using Input Timing Violation of Sequential Circuit on Cryptographic Module Under IEMI
Daisuke Fujimoto, Takumi Okamoto, Yang Li, Youngwoo Kim, Yuichi Hayashi
IEEE Transactions on Electromagnetic Compatibility, 2023
9
A Novel Remote Visualization of Screen Images Against High-Resolution Display with Divided Screens Focusing on the Difference of Transfer Function of Multiple Emanations
Taiki Kitazawa, Kimihiro Arai, Youngwoo Kim, Daisuke Fujimoto, Yuichi Hayashi
IEEE Transactions on Electromagnetic Compatibility, 2022
10
Simultaneous Security and EMC Evaluations Based on Measuring Electromagnetic Field Distributions on PCBs
Youngwoo Kim, Daisuke Fujimoto, Yuichi Hayashi
IEEE Electromagnetic Compatibility Magazine, 2022