SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Interposer Design
Electromagnetic Compatibility
Signal Integrity
발행물
전체 논문
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Youngwoo Kim*, Jonghyun Cho, Jonghoon J. Kim, Kyungjun Cho, Subin Kim, Srikrishna Sitaraman, Venky Sundaram
IEEE Transactions on Components, Packaging and Manufacturing Technology,
42
Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling
Youngwoo Kim, Jonghyun Cho, Jonghoon J. Kim, Kyungjun Cho, Subin Kim, Srikrishna Sitaraman, Venky Sundaram, Pulugurtha Markondeya Raj, Rao R. Tummala, Joungho Kim
IEEE Transaction on Electromagnetic Compatibility, 2017
43
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis
Daniel H. Jung, Youngwoo Kim, Jonghoon J. Kim, Heegon Kim, Sumin Choi, Yoon-Ho Song, Hyun-Cheol Bae, Kwang-Seong Choi, Stefano Piersanti, Francesco de Paulis, Antonio Orlandi, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017
44
Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel
Youngwoo Kim, Jonghyun Cho, Jonghoon J. Kim, Kiyeong Kim, Kyungjun Cho, Subin Kim, Srikrishna Sitaraman, Venky Sundaram, Pulugurtha Markondeya Raj, Rao Tummala, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2016