SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
High Bandwidth Memory
Signal Integrity
Reinforcement Learning
발행물
전체 논문
44
31
Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer with Through-Silicon Via
Youngwoo Kim, Hyunsuk Lee, Jinwook Song, Junyong Park, Seongsoo Lee, Subin Kim, Gapyeol Park, Kyungjune Son, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
32
A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels
Junyong Park, Sumin Choi, Jonghoon J. Kim, Youngwoo Kim, Manho Lee, Heegon Kim, Bumhee Bae, Huijin Song, Kyungjun Cho, Seongsoo Lee, Hyunsuk Lee, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2018
33
EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field
Chiuk Song, Hongseok Kim, Youngwoo Kim, Donghyun Kim, Seungtaek Jeong, Yeonje Cho, Seongsoo Lee, Seungyoung Ahn, Joungho Kim
IEEE Transactions on Industrial Electronics, 2018
34
Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High Bandwidth Memory (HBM) Interface
Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Heegon Kim, Sumin Choi, Subin Kim, Junyong Park, Seongsoo Lee, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018
35
Miniaturized and high-performance RF packages with ultra-thin glass substrates
Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao Tummala
Elsevier Microelectronics Journal, 2018
36
Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System
Shinyoung Park, Jinwook Song, Subin Kim, Youngwoo Kim, Manho Lee, Joungho Kim
IEEE Transactions,
37
Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling
Yougnwoo Kim*, Jonghyun Cho, Kyungjun Cho, Junyong Park, Subin Kim, Dong-Hyun Kim, Gapyeol Park, Srikrishna Sitaraman, Pulugurtha Markondeya Raj, Rao R. Tummala, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017
38
Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules
Srikrishna Sitaraman, Vijay Sukumaran, Markondeya Raj Pulugurtha, Zihan Wu, Yuya Suzuki, Youngwoo Kim, Venky Sundaram, Joungho Kim, Rao Tummala
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017
39
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test with Silicone Rubber-based Sheet Contact
Jonghoon J. Kim, Heegon Kim, Daniel H. Jung, Sumin Choi, Jaemin Lim, Youngwoo Kim, Junyong Park, Hyesoo Kim, Dongho Ha, Michael Bae, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2017
40
Through-Silicon Via Capacitance–Voltage Hysteresis Modeling for 2.5-D and 3-D IC
Dong-Hyun Kim, Youngwoo Kim, Jonghyun Cho, Bumhee Bae, Junyong Park, Hyunsuk Lee, Jaemin Lim, Jonghoon J. Kim, Stefano Piersanti, Francesco de Paulis, Antonio Orlandi, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017