SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Signal Integrity
Reinforcement Learning
Interposer Design
발행물
전체 논문
44
11
Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates
Youngwoo Kim
Micromachines, 2022
12
A Novel FDTD Approach Considering Frequency Dispersion of FR-4 Substrates for Signal Transmission Analyses at GHz Band
Taiki Kitazawa, Taiki Yamagiwa, Ren Kitahara, Youngwoo Kim, Jerdvisanop Chakarothai, Yuichi Hayashi, Takashi Kasuga
IEEE Transactions on Electromagnetic Compatibility, 2022
13
Channel Characteristic-based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer
Daehwan Lho, Hyunwook Park, Shinyoung Park, Subin Kim, Hyungmin Kang, Boogyo Sim, Seongguk Kim, Junyong Park, Kyungjun Cho, Jinwook Song, Youngwoo Kim, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 0202
14
Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer
Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daewhan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Seongtaek Jeong, Youngwoo Kim, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2022
15
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme
Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daewhan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Seongtaek Jeong, Youngwoo Kim, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021
16
Measurement and Analysis of Electromagnetic Information Leakage from Printed Circuit Board Power Delivery Network of Cryptographic Devices
Shinpei Wada, Yuichi Hayashi, Daisuke Fujimoto, Naofumi Homma, Youngwoo Kim
IEEE Transactions on Electromagnetic Compatibility, 2021
17
Measurement and Analysis of Through Glass Via (TGV) Noise Coupling and Shielding Structures in a Glass Interposer
Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Junyong Park, Insu Hwang, Jihye Kim, Kyungjune Son, Hyunwook Park, Atom O. Watanabe, Pulugurtha Markondeya Raj, Rao R. Tummala, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2021
18
A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System
Boogyo Sim, Seungtaek Jeong, Youngwoo Kim, Shinyoung Park, Seongsoo Lee, Seokwoo Hong, Jinwook Song, Hongseok Kim, Hyungmin Kang, Hyunwook Park, Daewhan Lho, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2021
19
Statistical Eye-diagram Estimation Method Considering Power/Ground Noise Induced by Simultaneous Switching Output (SSO) Buffers
Ngwoo Kim, Junyong Park, Joungho Kim, Yuichi Hayashi
IEEE Transactions on Electromagnetic Compatibility, 2020
20
Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure
Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Pulugurtha Markondeya Raj, Rao R. Tummala, Joungho Kim
IEEE Transactions on Microwave Theory and Techniques, 2020