SYSTEM PACKAGING AND INTERCONNECTION (SPAI) LABORATORY
세종대학교 본교(제1캠퍼스) 반도체시스템공학과
김영우 교수
Signal Integrity
Interposer Design
Reinforcement Learning
발행물
전체 논문
44
21
Signal Integrity Design and Analysis of 3D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing
Kyungjune Son, Kyungjun Cho, Subin Kim, Shinyoung Park, Daniel H. Jung, Junyong Park, Gapyeol Park, Seongguk Kim, Taein Shin, Youngwoo Kim, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020
22
Segmentation Method based Modeling and Analysis of a Glass Package Power Distribution Network (PDN)
Youngwoo Kim, Daisuke Fujimoto, Shugo Kaji, Shinpei Wada, Hyunwook Park, Daehwan Lho, Joungho Kim, Yu-ichi Hayashi
IEICE Nonlinear Theory and Its Applications (NOLTA), 2020
23
Deep Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for Silicon Interposer-based 2.5-D/3-D ICs
Hyunwook Park, Junyong Park, Subin Kim, Kyungjun Cho, Daehwan Lho, Seungtaek Jung, Shinyoung Park, Gapyeol Park, Boogyo Sim, Seongguk Kim, Youngwoo Kim, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020
24
A Frequency Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems using Resonant Frequency Control of a Shieldi
Seokwoo Hong, Youngwoo Kim, Seungtaek Jeong, Boogyo Shim, Hongseok Kim, Seungyoung Ahn, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology,
25
A Frequency Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems using Resonant Frequency Control of a Shielding Coil in Smartphone Application
oogyo Shim, Hongseok Kim, Seungyoung Ahn, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2019
26
Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling
Junyong Park, Shinyoung Park, Youngwoo Kim, Gapyeol Park, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Seongsoo Lee, Dong-Hyun Kim, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2019
27
Fast and Accurate Power Distribution Network (PDN) Modeling of A Silicon Interposer for 2.5-D/3-D ICs with Multi-array TSVs
Kyungjun Cho, Youngwoo Kim, Subin Kim, Hyunwook Park, Junyong Park, Seongsoo Lee, Daeyong Shim, Sangmook Oh, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
28
A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation with N-Level (PAM-N) on Stacked Through-Silicon Vias
Junyong Park, Daniel H. Jung, Byunggon Kim, Sumin Choi, Youngwoo Kim, Shinyoung Park, Gapyeol Park, Kyungjun Cho, Seongsoo Lee, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2019
29
Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC
Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
30
Signal Integrity Design and Analysis of Differential High-Speed Serial Li
Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Jinwook Song, Junyong Park, Seongsoo Lee, Subin Kim, Gapyeol Park, Kyungjune Son, Joungho Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology,